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Vacuum reflow equipment - List of Manufacturers, Suppliers, Companies and Products

Vacuum reflow equipment Product List

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Formic Acid Reduction Reflow Device [Case Study: Characteristics of Reflowed Solder]

Formic Acid Reduction Reflow Device [Case Study: Characteristics of Reflowed Solder]

Solved with the Unitemp reflow device! Significant high-speed cooling! A cooling rate of nearly 3°C per second from solder melting to solidification!

When molten solder takes too long to cool and solidify, it negatively affects the solder joint strength and electrical characteristics. It is a problem if the characteristics deteriorate due to cooling speed issues. Our reflow equipment is equipped with an active water cooling system using circulating cooling water as standard. This allows us to maximize the solder characteristics after reflow. [Case Summary] ■ Issue: If the molten solder takes too long to cool and solidify, it negatively impacts the solder joint strength and electrical characteristics. ■ Solution: - Standard equipped with an active water cooling system using circulating cooling water. - This not only improves the strength and electrical characteristics of the solder but also reduces the tact time. *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Vacuum Reflow Device "RNV162 Series"

Vacuum Reflow Device "RNV162 Series"

The combination of top and bottom hot air circulation heating and vacuum pressure enables high-quality, highly reliable soldering!

The "RNV162 Series" is a high-performance vacuum reflow device that excels in usability. Thanks to the combined effect of hot air circulation heating and vacuum suction, it significantly reduces void generation even with large areas of solder, achieving a void area of less than 1% when used in combination with solder paste. Additionally, compared to hot plate heating methods, it has a smaller temperature variation (Δt) and allows for a reduction in reflow time. 【Features】 ■ Significantly reduces void generation even with large areas of solder ■ Incredible flux recovery system ■ Suitable for mass production with inline transport ■ Greatly reduces flux adhesion dripping issues ■ Upper and lower hot air circulation heating method *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines
  • Soldering Equipment

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Vacuum Reflow Equipment "RNV152/RSV152 Series"

Vacuum Reflow Equipment "RNV152/RSV152 Series"

Continuous inline transport suitable for mass production! High-performance vacuum reflow device with excellent usability.

The "RNV152/RSV152 series" is a high-performance vacuum reflow device that is user-friendly and offered at a low price. By combining upper and lower hot air circulation heating with vacuum pressure, it enables high-quality and highly reliable soldering that surpasses the conventional concept of temperature profiles, even in a limited heating zone. The design features lightweight construction of the furnace body, the use of low thermal conductivity insulation materials, double insulation, and resin covers for insulation, achieving ultra-low power consumption through high insulation specifications. 【Features】 ■ High-performance vacuum reflow device with excellent usability ■ Upper and lower hot air circulation heating method ■ Ultra-low power consumption and high insulation specifications (approximately 40% energy saving) ■ Continuous inline transport suitable for mass production ■ Can also be used as an N2 reflow furnace *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines
  • Soldering Equipment

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Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'

Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'

Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!

The "VSS-450-300" is a tabletop vacuum solder reflow device that flexibly accommodates various applications, including solder reflow, oxidation-reduction processing, and paste sintering. With an effective heating area of 300×300×50mm, it can easily handle the mounting of tall components. 【Features】 - Compatible with both fluxless solder (reduction method) and flux-containing solder - Achieves a maximum temperature of 450°C despite its tabletop size - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow - Optional support for formic acid reduction reflow and forming gas (hydrogen + nitrogen) reflow - Supports rapid cooling through a water cooling system *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Solve it with the Unitemp reflow device! Vacuum (decompression) is possible even when the chamber is at high temperature after reaching the melting point!

When X-raying the state after the solder has solidified, there are cases where something resembling bubbles appears within the solder, which is referred to as "voids." If the solder solidifies with these voids remaining, the joint strength and electrical characteristics deteriorate. It is essential to ensure that voids are removed during the process. Our reflow equipment can accommodate a vacuum (reduced pressure) environment of up to 10^-3 hPa, allowing for the evacuation of voids. It is possible to create a profile that allows for the solder to be heated to its melting point after establishing a vacuum state, and also to perform vacuum evacuation while the solder is in a molten state. [Case Overview] ■ Issue - If the solder solidifies with voids remaining, the joint strength and electrical characteristics deteriorate. ■ Solution - By performing vacuum evacuation (reduced pressure) while the solder is molten, voids can be actively removed from the molten solder. *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Single-chamber vacuum reflow device 'NRY-703WSZ/VA'

Single-chamber vacuum reflow device 'NRY-703WSZ/VA'

Void processing for power module metal substrate reflow is possible!

The "NRY-703WSZ/VA" is a single-chamber (1 zone) vacuum reflow device capable of preheating, heating, and cooling in a single chamber. Thanks to the floating gas extraction heating (Patent No. 5576577), thermal processing can be performed without the influence of warping or bending. Additionally, by injecting nitrogen, reflow soldering and bump formation can be achieved with an oxygen concentration of less than 10 ppm. 【Features】 ■ Void treatment during the formation of solder bumps on wafers ■ By reducing the chamber pressure during solder melting, void removal is possible ■ Supports automatic inline integration by connecting with the entrance conveyor (standard equipment) *For more details, please download the PDF or contact us.

  • Reflow Equipment

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